What is solvent-free adhesive "DUALAM"?
Solvent-free adhesives, also known as non-solvent adhesives, are composed of liquid base resins and hardeners that bond through chemical reaction without the use of organic solvents for dilution.
Since they eliminate the need for evaporation and drying processes, these adhesives significantly reduce energy consumption and CO2 emissions, balancing environmental sustainability with cost efficiency.
Furthermore, the absence of solvent migration risk provides a distinct advantage in ensuring the safety of food packaging.
On the other hand, compared to solvent-based types, they face challenges such as lower initial bond strength, reduced viscosity stability, and a higher tendency for visual defects in the finished package.
To overcome these issue, DIC has developed "DUALAM", an adhesive for a separate application system. This breakthrough technology resolves conventional limitations and opens up new possibilities for the lamination process.
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